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SK Hynix Latest News, Events, Press Releases (2025/3/12 Update)

SK hynix’s HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.

The new 24Gb DDR5 was produced with the cutting-edge 1anm technology that utilizes EUV process.

SK hynix expects the new technology to bring an improvement in productivity, and further boost cost competitiveness.

The new product, LPDDR5T, operates at a data rate of 9.6 gigabits per second (Gbps), 13% faster than the previous generation LPDDR5X1 unveiled in November 2022.

SK hynix’s HBM2E supports over 460GB (Gigabyte) per second with 1,024 I/Os (Inputs/Outputs) based on the 3.6Gbps (gigabits-per-second) speed performance per pin.

In the meantime, SK hynix has conducted joint-operation of on-site lab, system-level test, and simulation with System-on-Chip1) (SoC) manufacturers to verify the function

The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its d

SK hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash (CTF) with high-integrated Peri.

This product will be equipped in premium smartphones to support an optimal environment for games with high resolution image and also high quality videos.

SK hynix plans to provide the latest mobile DRAM products to smartphone manufacturers from the second half of 2021.

This product will be equipped in premium smartphones to support an optimal environment for games with high resolution image and also high quality videos.

SK hynix’s DDR5 delivers an outstanding performance per watt* and carbon emissions reduction effect to server customers as it reduces power consumption by up to 20% compa

MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.

Since development of the 96-layer NAND product in 2018, SK hynix has introduced a series of 4D products that outperform existing 3D products.

The announcement comes just seven months after the company became the first in the industry to develop HBM3 in October, and is expected to solidify the company’s leadersh

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