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SK Hynix Latest News, Events, Press Releases (2024/11/22 Update)

This product will be equipped in premium smartphones to support an optimal environment for games with high resolution image and also high quality videos.

SK hynix’s DDR5 delivers an outstanding performance per watt* and carbon emissions reduction effect to server customers as it reduces power consumption by up to 20% compa

MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.

Since development of the 96-layer NAND product in 2018, SK hynix has introduced a series of 4D products that outperform existing 3D products.

The announcement comes just seven months after the company became the first in the industry to develop HBM3 in October, and is expected to solidify the company’s leadersh

Launched as SK hynix’s first PCIe 4.0 SSD built with advanced 176-layer NAND flash memory, the Platinum P41 is now available for purchase on Amazon in 500GB, 1TB and 2TB

The P5530 combines SK hynix’s 128-layer 4D NAND flash with Solidigm’s SSD controller* and firmware supporting a PCIe* Gen 4 interface.

SK hynix plans to showcase its PIM development at the world’s most prestigious semiconductor conference, 2022 ISSCC*, in San Francisco at the end of this month.

SK hynix’s HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.

The new 24Gb DDR5 was produced with the cutting-edge 1anm technology that utilizes EUV process.

SK hynix expects the new technology to bring an improvement in productivity, and further boost cost competitiveness.

The new product, LPDDR5T, operates at a data rate of 9.6 gigabits per second (Gbps), 13% faster than the previous generation LPDDR5X1 unveiled in November 2022.

SK hynix’s HBM2E supports over 460GB (Gigabyte) per second with 1,024 I/Os (Inputs/Outputs) based on the 3.6Gbps (gigabits-per-second) speed performance per pin.

In the meantime, SK hynix has conducted joint-operation of on-site lab, system-level test, and simulation with System-on-Chip1) (SoC) manufacturers to verify the function

The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its d

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